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Leading technology opens the future of the Post PC market.
History
2016
~2019
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2019
Development and Certification of the Cloud Computing Application Platform (HICLOUD) for Training (TTA-18-04754)
Microsoft Education Partner Agreement
Registering a direct distributor of LG Display (Chinese corporation)
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2018
High-performance HMI 2nd generation ODM delivery contract (Company L)
Dental X-ray HMIboard ODM Delivery Contract (Company L)
Phone type_ Delivery of life test equipment (LG Display)
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2017
LG Display Equipment Company Registration
Delivery of portable inspection equipment (LG Display_Vietnam)
Intel CNDA (Technical Supply) Agreement
HMI Delivery contract for skin care therapy (Company B)
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2016
TECHPANENT ODM Delivery Contract for Robots (Company R)
Convention on the Entrepreneurship of the Industrial-Academic-Universal School
First launch of IoT education equipment based on Intel Edison (ThingDue Series)
2011
~2015
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2015
Industrialized HMI ODM Delivery Contract (Company L)
Delivery of Watch-type life test equipment (LG Display)
Delivery contract for transmission module (ECM) of electrocardiograph (Company M)
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2014
Build assembly production lines (factory registration)
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2013
Digital Radio equivalent product development (Korea Institute of Industrial Technology Evaluation)
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2012
Development of Carbon Inventory Products for IDC Center (i-PDU)
Delivery contract for Medical laser HMI (Company L)
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2011
Delivery of the LCM MT/FT Inspector (Hydis, TOC)
Delivery of MIPI-enabled OLED Tester (LG Display, Samsung Display)
Delivery contract for RF Instrument Core Module ODM for wireless equipment and base stations (Company V)
2007
~2010
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2010
Open Hybus Education Center (Seoul Guro)
Contract for DR video wireless transmission board (Company D)
Android Developer Board Launched
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2009
ODM delivery contract for Dental X-ray image acquisition terminal (Company V)
Delivery Contract for Control Board ODM for Entry and Exit Control (Company C)
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2008
Swiss Robot Company K-Team Distrobutor Contract
Delivery Contract for boards of overloaded vehicles (Company S)
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2007
Korea Oracle Embedded Business Sector Collaboration NDA Signed
Contract for joint core components business of medical equipment (Wonju Techno Park)
Delivery Contract for X-ray HMI board for dental use (Company V)
2001
~2006
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2006
Selected as INNOBIZ of Small and Medium Business Administration
Establishment of the Daegu Company of Hybus tech
Digital Oscilloscope Board ODM Delivery Agreement (Company E)
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2005
ISO 14000/ISO 9001 Certification
Official Distributor Agreement of CrossBow, USA
Wireless SensorNetwork System First Launch (H-Mote Series)
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2004
Selection of the Small and Medium Business Administration's technology innovation development project implementer
First launch of LCM pattern tester (PDK Series)
Development of RF-GATE Board for New Traffic in Seoul Metropolitan Subway
China University and India Embedded Education Center Selection of Educational Reporters
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2003
Designation of Excellent Technology Venture Company
Establishment of a subsidiary Research Institute
Body fat measurement board ODM delivery contract (Company B)
Samsung Multicampus Embedded Educational Reporters Selection
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2002
Selection of Embedded Software Steering Committee
Embedded Developer Board First Launch (X-Hyper Series
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2001
Establishment of Hybus